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Large Size Aluminum LED PCB Assembly Panel IP67 Waterproof For Advertising Backlight
Large Size LED Aluminum PCB Panel Module IP67 Waterproof 900x900mm Max for advertising backlight
Large-size waterproof LED module
No additional heat sink is required
Can customize size you need, maximum 0.9x0.9m
LED spacing options 16mm, 25mm, 33mm
Standard size 300x300mm, 300x600mm, 600x600mm
Patent number: ZL200820131053, ZL200820132702
lighting fixtures Light source, advanced advertising backlight
Input voltage DC12V (Optional: DC24V)
LED chip luminous efficiency: 150Lm / W
CE RoHS FCC
Please contact us if you need any special dimension, power, CRI, or efficiency, we are the company special make custom led pcb modules.
Emitter Brand | Shinelink |
Emitter Model | SMD 2835 High brightness |
LED Chips | SMD 2835 |
Power | 1.5W |
Luminous Flux | 10lm(manufacturer rated) |
Driving Current | 240mA |
Voltage | 220V AC |
Temperature Color | 662nm Red |
PCB Dimension | 43mmx35mm Hole: 11mm |
Long life Span | >50000Hours |
CRI | >70 |
Power Factor | >80% |
Certification | CCC CE CQC RoHS |
Applications | Craft lights |
Files Requested For PCB Assembly Quotation
---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required
Shinelink kinds PCBA product
94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils
THT(Wave soldering) process (RoHs Compliant) Capabilities up to:
1.Single side wave soldering
2.SMT & THT mixture process
PCB Assembly Capabilities
Turnkey PCBA | PCB+components sourcing+assembly+package |
Assembly details | SMT and Thru-hole, ISO lines |
Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test |
Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) |
Components: Bill of Materials(BOM list) | |
Assembly: Pick-N-Place file | |
PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) |
Max size: 20*20 inches(500*500mm) | |
PCB Solder Type | Water Soluble Solder Paste, RoHS lead free |
Components details | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
PCBA Picture
FAQ:
1. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.
2. What’s the merits of O-leading's rIgid-flex PCB?
SHINELINK’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.
3. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.